Patent Issued for Encapsulated Liquid Level Sensor Device

November 21, 2013
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By a News Reporter-Staff News Editor at Electronics Newsweekly — A patent by the inventors Cantolino, Christopher (Bradenton, FL); Sells, Robert Dean (Palmetto, FL), filed on November 2, 2010, was published online on November 12, 2013, according to news reporting originating from Alexandria, Virginia, by VerticalNews correspondents.

Patent number 8578770 is assigned to Cantolino Industries, Inc. (Sarasota, FL).

The following quote was obtained by the news editors from the background information supplied by the inventors: “An encapsulated liquid level sensor device and a method of encapsulating the liquid level sensor device.

“Sensors to monitor liquid levels are well known in the art. Such sensors often include a float member which rises and falls with the changing liquid level in a drain pipe, drain pan or tank. Float actuated switches are commonly used in equipment and systems to prevent overflow of liquid such as condensate in air conditioning and refrigeration systems.

“Often such float sensors and switches have been replaced by more reliable electronic probe switch devices. These devices eliminate moving parts generally using instead, a pair of probe sensors for detecting rising water levels.

“Further efforts have been undertaken to produce module structures to encapsulate electronic components on circuit boards to protect the components from the surrounding environment are represented by the patent documents discussed below.

“U.S. 2002/0189346 relates to a device for sensing a level of a fluid including a microcontroller disposed within a housing and a probe coupled to the microcontroller. The microcontroller applies a given DC potential to the probe for a first period of time, measures a voltage associated with the level of the fluid to be sensed after the first period of time and applies a reference DC potential to the probe for a second period of time.

“U.S. 2003/0173707 shows the use of polyamide based molding compositions for the production of moldings and for adhesive sealing or filling in the production of electrical or electronic devices, in particular of plugs, cables, switches, sensors, transponders and modules.

“U.S. 2006/0003137 discloses a method of encapsulating a component assembly comprising a first layer having a first set of physical properties and a second layer having a second set of physical properties to protectively surround the component assembly. A continuous transitory material is formed between the first layer and the second layer at associated first and second margin portions such that the first layer and the second layer are not prone to delamination.

“U.S. 2006/0171127 describes a control unit including a plurality of electronic parts sealed with a resin.

“U.S. 2006/0208915 discloses a liquid level control switch comprising a plurality of electronic components enclosed in a case including electrically conductive sensor-probe pins extend from a PC board and are positioned for detecting liquids at various levels within drains, drain pans, tanks, reservoirs and pipes of various dimensions.

“U.S. 2008/0179962 relates to a leak detector pad comprising a circuit board having a bottom surface and a top surface, spaced first and second electrically conductive traces located on the bottom surface, and an electronic circuit mounted on the top surface.

Article source: http://www.hispanicbusiness.com/2013/11/20/patent_issued_for_encapsulated_liquid_level.htm

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